Leadless socket for decapped semiconductor device

Semiconductor devices are currently in widespread use in a variety of electronic components. Semiconductor devices may be used for a variety of reasons, such as to retain information, as in a non-volatile memory device, or to perform a calculation, such as in a microprocessor or in a digital signal processor. Semiconductor devices typically have a protective housing that houses semiconductor circuitry within the semiconductor device and leads connected with the semiconductor circuitry for connecting the semiconductor circuitry to a circuit board. Sometimes, a semiconductor device may fail due to a defect either in the manufacturing process or the design process. To determine why a particular semiconductor device has failed, the semiconductor device requires testing. In order to test the semiconductor device, the device needs to be decapped, that is, a portion of the top side of the protective housing needs to be removed in order to expose the semiconductor circuitry within. An apparatus for mounting a semiconductor device to a circuit board for testing is disclosed. The semiconductor device includes semiconductor circuitry and leads to connect the semiconductor circuitry to the circuit board. Additionally, the semiconductor device is decapped so that at least a portion of the semiconductor circuitry is exposed. The apparatus includes a frame and a fastener. The frame is adapted to mate with the semiconductor device, and forms an opening for accessing the semiconductor circuitry and an edge surface for receiving the semiconductor device. The fastener is connected with the frame for removably connecting the frame to the circuit board. By using a frame instead of a socket, the distance to the semiconductor device once the device is mounted to the circuit board, and particularly the top side of the semiconductor device, can be reduced so that the device may be tested using a probe.