Semiconductor module including a plurality of semiconductor devices detachably

The present invention generally relates to semiconductor devices and more particularly to a semiconductor module that includes therein a plurality of semiconductor devices each in turn including a substrate carrying thereon a semiconductor chip. Further, the present invention relates to a semiconductor module assembly including a socket that holds the substrate of the semiconductor device detachably. A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.