Miniature microdevice package and process for making thereof

The present invention is concerned with a miniature microdevice package and a process of fabricating such a miniature microdevice package. Miniature microdevice packages are made for miniature microdevices such as accelerometers, digital micromirrors, emitters and detectors. Several of these miniature microdevices also require a window transparent to radiation at wavelength of device operation. The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.