Method of trimming and singulating leaded semiconductor packages

This invention relates to leaded semiconductor packages and a method of trimming and singulating such packages using a panel with a plurality of lead frames. When leaded semiconductor packages are formed, semiconductor dies are mounted onto lead frames of a panel, via adhesive tape to be later removed. Such frames are arranged in plural snips. Each frame has plural leads, which are formed when the panel is punched and which are singulated when such strips are sawn across.