Slotted substrates and techniques for forming same

The present invention relates to substrates such as those used in inkjet printheads and the like. Techniques for fabricating an inkjet printhead include providing a printhead substrate, fabricating a thinfilm structure on the substrate, forming a break trench in a surface region of the substrate in...

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Bibliographische Detailangaben
1. Verfasser: Hostetler, Timothy S
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to substrates such as those used in inkjet printheads and the like. Techniques for fabricating an inkjet printhead include providing a printhead substrate, fabricating a thinfilm structure on the substrate, forming a break trench in a surface region of the substrate in which a feed slot is to be formed, and subsequently abrasively machining the substrate through the break trench to form the feed slot. The break trench can be formed by an etch process, prior to applying a barrier layer to the thinfilm structure in a preferred embodiment.