Method for copper plating deposition
The present invention is related to metal deposition processes as used for instance for the formation of conductive patterns connecting active or passive devices as well as integrated circuits. In particular, such conductive patterns can be formed at least partly by means of a plating deposition tec...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention is related to metal deposition processes as used for instance for the formation of conductive patterns connecting active or passive devices as well as integrated circuits. In particular, such conductive patterns can be formed at least partly by means of a plating deposition technique.
The present invention describes a method for copper deposition on a substrate having a barrier layer wherein a substrate () and an activator () are immersed in a copper plating bath in order to contact each other for a predetermined period. |
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