Method and apparatus for disassembling joined layers

The present invention relates generally to disassembly of layers joined by bonding, such as welding, and more particularly to disassembling at least two joined layers with vibrational energy. The present invention is a disassembly apparatus and method for disassembling a workpiece having at least two layers joined together by welding or other bonding processes at bonding points. The method includes the steps of securing the workpiece into a fixture to prevent movement of one of the layers. The apparatus includes a sonotrode and a holding device. The method further includes moving the sonotrode to contact the workpiece to apply a predetermined amount of contact pressure to the workpiece. The sonotrode in contact with the layer on a side opposite the anvil is then vibrated at a predetermined frequency until the layers become disassembled. An apparatus for performing the method is also disclosed.