Method for dismantling a guide ring

The present invention relates to an auxiliary tool for dismantling a guide a ring and an application method of the same, and more particularly, to an auxiliary tool for dismantling a guide ring which is closely engaged with a top ring module, and to an application method of the same. The present invention is to provide an auxiliary tool for dismantling a guide ring, and an application method of the same. The auxiliary tool of the present invention for dismantling a guide ring is to install a plurality of supporting elements on the top of a guide ring whose structure is the same as that of the guide ring to be dismantled, thereby dismantling the guide ring closely engaged with a top ring module, wherein the top ring module is used in a chemical-mechanical polishing (CMP) machine for carrying a wafer, and the guide ring to be dismantled is for holding the wafer within the top ring module. The application method of the auxiliary tool for dismantling a guide ring is first to insert the supporting elements of the auxiliary tool of the present invention into the grooves of the top ring modules, and thereafter to tap a combined surface of the guide ring and top ring module in a way like plotting a circle, so as to disengage the guide ring from the top ring module. The application of the present invention can significantly reduce the time for replacing a guide ring thereby cutting the maintenance cost, and further prevent the top ring module from cracking, wherein the cracking event is resulted from the force exerted by maintenance crew, and usually would cause the top ring module to be totally scrapped.