Method of laser drilling

This application claims priority under 35 U.S.C. §119 on German patent application number DE 10145184.9 filed Sep. 13, 2001, the entire contents of which are hereby incorporated herein by reference. In a method for the laser drilling of holes in a circuit substrate with the aid of a perforated mask,...

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Hauptverfasser:	De Steur, Hubert, Mayer, Hans Juergen, Märten, Otto, Overmann, Christian, Pan, Wei, Roelants, Eddy, Wehner, Martin
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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