Method of laser drilling

This application claims priority under 35 U.S.C. §119 on German patent application number DE 10145184.9 filed Sep. 13, 2001, the entire contents of which are hereby incorporated herein by reference. In a method for the laser drilling of holes in a circuit substrate with the aid of a perforated mask, a laser beam is moved in the region of the perforated mask on a circular path. The center point of the region lies concentrically with respect to the set position of the respective hole in the mask. Further, the diameter of the region is smaller than the diameter of the hole. At the same time, the diameter of the laser beam spot is chosen to be large enough that it always covers the center point of the perforated mask during the circular motion. As a result, an energy distribution of the laser energy, which is as uniform as possible, is achieved in the region of the perforated mask.