Polishing head for pressurized delivery of slurry

The present invention is directed, in general, to the polishing of semiconductor wafers and, more specifically, to a polishing head for delivering slurry, a polishing system employing the polishing head and a method manufacturing an integrated circuit incorporating the polishing head or the polishing system. The present invention provides a polishing head, for use with a polishing apparatus. In one embodiment, the polishing head includes a carrier head assembly, and a retaining ring having a surface positionable adjacent a polishing pad and couplable to the carrier head assembly and configured to retain a semiconductor wafer therein, the retaining ring having a slurry conduit located therethrough to provide a flow of slurry to the polishing pad.