Flip-chip assembly for optically-pumped lasers

Flip-chip assembly for optically-pumped lasers

The present disclosure generally relates to semiconductor device manufacture, and, more particularly, to methods for fabricating optically-pumped vertical cavity surface-emitting lasers ("VCSELs"). A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a l...

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Bibliographische Detailangaben
Hauptverfasser: Yuen, Albert T, Tan, Michael R. T, Babic, Dubravko Ivan, Corzine, Scott William
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure generally relates to semiconductor device manufacture, and, more particularly, to methods for fabricating optically-pumped vertical cavity surface-emitting lasers ("VCSELs"). A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a long-wavelength VCSEL. The short-wavelength VCSEL is used to optically-pump the long-wavelength VCSEL. Certain embodiments of the invention can serve as optical sources for optical fiber communication systems. Methods also are provided.