Resin composition containing crystalline polyimide

The present invention relates to a thermoplastic resin composition composed mainly of a crystalline polyamide and a thermoplastic polyester. More particularly it relates to a polyamide/polyester-based thermoplastic resin composition having excellent heat-resistance, mechanical characteristics such as mechanical strength and elastic modulus and/or moldability such as the fluidity in molding and usable as a molded article such as an electronic part suitable for surface mounting and a film. A resin composition containing a mixture produced by blending a crystalline polyamide expressed e.g. by formula (1) (in the formula, Ris a bivalent organic aromatic group or aliphatic group having a carbon number of 2 to 30, optionally having substituent and optionally containing non-reactive groups such as ether group and aromatic group in the main chain, and Aris an aromatic residue having a carbon number of 6 to 45 and optionally having substituent) with a thermoplastic polyester. The resin composition has excellent mechanical characteristics such as high elastic modulus, flow properties and heat-resistance and is suitable as a material for an electronic part for surface mounting.