System and method for mounting electronic components onto flexible substrates

The present invention relates to an system and method for reflowing solder to electrically connect electronic components to a flexible substrate having a low softening temperature. A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.