Transparent conductive heat sealing material and carrier tape lid using the same

The present invention relates to a transparent conductive heat sealing material suitably applicable for a lid of a carrier tape package used upon storing, transporting or mounting electronic products easily susceptible to breakage by static electricity, particularly such as a chip-type electronic pr...

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Bibliographische Detailangaben

Hauptverfasser:	Inoue, Isao, Takamori, Hiroko, Hyakutome, Masumi, Fujii, Kazuhito, Imamura, Hideki
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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