Transparent conductive heat sealing material and carrier tape lid using the same

The present invention relates to a transparent conductive heat sealing material suitably applicable for a lid of a carrier tape package used upon storing, transporting or mounting electronic products easily susceptible to breakage by static electricity, particularly such as a chip-type electronic product or an electronic circuit board already mounting parts, and a carrier tape lid using the same. The present invention has a main object to provide a transparent conductive heat sealing material of which antistatic property does not deteriorates even at a low humidity, and has a transparency to an extent of permitting visual recognition of the contents and a carrier tape lid using the same. To achieve this object, the transparent conductive heat sealing material of the invention is characterized by a heat-sealable synthetic resin, and conductive fine particle having a 50% particle size of up to 1.0 m.