Apparatus for removing contaminants from a workpiece using a chemically reactive additive

1. Technical Field An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chem...

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Bibliographische Detailangaben

Hauptverfasser:	Gaylord, III, Richard Hilliard, Kern, Jr., Frederick William, Martin, Donald Joseph, Okorn-Schmidt, Harald Franz, Snyder, John Joseph, Syverson, William Alfred
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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