Apparatus for removing contaminants from a workpiece using a chemically reactive additive

Apparatus for removing contaminants from a workpiece using a chemically reactive additive

1. Technical Field An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chem...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Gaylord, III, Richard Hilliard, Kern, Jr., Frederick William, Martin, Donald Joseph, Okorn-Schmidt, Harald Franz, Snyder, John Joseph, Syverson, William Alfred
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Gaylord, III, Richard Hilliard
Kern, Jr., Frederick William
Martin, Donald Joseph
Okorn-Schmidt, Harald Franz
Snyder, John Joseph
Syverson, William Alfred
description 1. Technical Field An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rinse liquid so that the liquid and any contaminants contained therein are removed from the water surface.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06634371</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06634371</sourcerecordid><originalsourceid>FETCH-uspatents_grants_066343713</originalsourceid><addsrcrecordid>eNqNjEsKAjEQRLNxIeod-gKCEhnXIooHcONqaDI9Y2N-dJIRb28CHsBVFdSrt1SPU4womEuCMQgIuTCzn8AEn9GxR5_rIsEBwjvIKzIZgpIag2Ce5NigtZ_6RJN5JsBh4FbWajGiTbT55UrB9XI_37YlRcxUvf0kTd_vuk4f9HGv_0C-4mk8FQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Apparatus for removing contaminants from a workpiece using a chemically reactive additive</title><source>USPTO Issued Patents</source><creator>Gaylord, III, Richard Hilliard ; Kern, Jr., Frederick William ; Martin, Donald Joseph ; Okorn-Schmidt, Harald Franz ; Snyder, John Joseph ; Syverson, William Alfred</creator><creatorcontrib>Gaylord, III, Richard Hilliard ; Kern, Jr., Frederick William ; Martin, Donald Joseph ; Okorn-Schmidt, Harald Franz ; Snyder, John Joseph ; Syverson, William Alfred ; International Business Machines Corporation</creatorcontrib><description>1. Technical Field An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rinse liquid so that the liquid and any contaminants contained therein are removed from the water surface.</description><language>eng</language><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6634371$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64016</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6634371$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gaylord, III, Richard Hilliard</creatorcontrib><creatorcontrib>Kern, Jr., Frederick William</creatorcontrib><creatorcontrib>Martin, Donald Joseph</creatorcontrib><creatorcontrib>Okorn-Schmidt, Harald Franz</creatorcontrib><creatorcontrib>Snyder, John Joseph</creatorcontrib><creatorcontrib>Syverson, William Alfred</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Apparatus for removing contaminants from a workpiece using a chemically reactive additive</title><description>1. Technical Field An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rinse liquid so that the liquid and any contaminants contained therein are removed from the water surface.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNjEsKAjEQRLNxIeod-gKCEhnXIooHcONqaDI9Y2N-dJIRb28CHsBVFdSrt1SPU4womEuCMQgIuTCzn8AEn9GxR5_rIsEBwjvIKzIZgpIag2Ce5NigtZ_6RJN5JsBh4FbWajGiTbT55UrB9XI_37YlRcxUvf0kTd_vuk4f9HGv_0C-4mk8FQ</recordid><startdate>20031021</startdate><enddate>20031021</enddate><creator>Gaylord, III, Richard Hilliard</creator><creator>Kern, Jr., Frederick William</creator><creator>Martin, Donald Joseph</creator><creator>Okorn-Schmidt, Harald Franz</creator><creator>Snyder, John Joseph</creator><creator>Syverson, William Alfred</creator><scope>EFH</scope></search><sort><creationdate>20031021</creationdate><title>Apparatus for removing contaminants from a workpiece using a chemically reactive additive</title><author>Gaylord, III, Richard Hilliard ; Kern, Jr., Frederick William ; Martin, Donald Joseph ; Okorn-Schmidt, Harald Franz ; Snyder, John Joseph ; Syverson, William Alfred</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_066343713</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Gaylord, III, Richard Hilliard</creatorcontrib><creatorcontrib>Kern, Jr., Frederick William</creatorcontrib><creatorcontrib>Martin, Donald Joseph</creatorcontrib><creatorcontrib>Okorn-Schmidt, Harald Franz</creatorcontrib><creatorcontrib>Snyder, John Joseph</creatorcontrib><creatorcontrib>Syverson, William Alfred</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Gaylord, III, Richard Hilliard</au><au>Kern, Jr., Frederick William</au><au>Martin, Donald Joseph</au><au>Okorn-Schmidt, Harald Franz</au><au>Snyder, John Joseph</au><au>Syverson, William Alfred</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Apparatus for removing contaminants from a workpiece using a chemically reactive additive</title><date>2003-10-21</date><risdate>2003</risdate><abstract>1. Technical Field An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rinse liquid so that the liquid and any contaminants contained therein are removed from the water surface.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_06634371
source USPTO Issued Patents
title Apparatus for removing contaminants from a workpiece using a chemically reactive additive
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T02%3A37%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Gaylord,%20III,%20Richard%20Hilliard&rft.aucorp=International%20Business%20Machines%20Corporation&rft.date=2003-10-21&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06634371%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true