Method and system for determining component dimensional information

The present invention relates to automated systems for mounting electronic components to various carriers. Specifically, a system and method are described which can determine component dimensional data and store the data for use in an automated attachment tooling process. A method and system for det...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Slesinger, Kris A
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to automated systems for mounting electronic components to various carriers. Specifically, a system and method are described which can determine component dimensional data and store the data for use in an automated attachment tooling process. A method and system for determining component dimensional information in a component placement system. The component information is derived from the pick and place equipment which is used to place the components on the substrate. The component is grasped at substantially the centroid position and moved over the aperture of a camera. The edges of the component are located, and from the edges an accurate location of the centroid may be obtained. The centroid, as well as the length, width and thickness of the component is stored in a database for use during placing of the component. Other features derived include orientation indicia obtained from component features which are viewed by the camera. During placement, all features associated with the component necessary to accurately locate the component on a substrate are obtained from the database.