Electric connection structure for electronic power devices, and method of connection

The present invention regards an electric connection structure for electronic power devices, and a method of connection. On a semiconductor material body housing an electronic device a peripheral region of semiconductor material and at least one pad are initially formed. The peripheral region is connected to a first terminal of the electronic device and extends on at least one peripheral portion of the semiconductor material body. The pad is insulated from the semiconductor material body and is electrically connected to a second terminal of the electronic device. The semiconductor material body is fixed to a support body formed by a blank belonging to a reel. The pad is connected by a wire to an electrode formed by the blank. Next, a connection region is formed on the peripheral region and surrounds, at least partially, the semiconductor material body and the support body. The connection region is advantageously obtained by galvanic growth.