Method for creating a connection within a multilayer circuit board assembly

The present invention relates to a method for making an electrical circuit board and more particularly, to a method for making a multi-layer electrical circuit board having interconnections between portions or layers of the circuit board. A method for forming connections within a multi-layer electro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shi, Zhong-You (Joe), Goenka, Lakhi N, Glevatsky, Andrew Z
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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