Method for creating a connection within a multilayer circuit board assembly

The present invention relates to a method for making an electrical circuit board and more particularly, to a method for making a multi-layer electrical circuit board having interconnections between portions or layers of the circuit board. A method for forming connections within a multi-layer electronic circuit board . The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.