Heat sink assembly and method

The present invention relates to a heat sink assembly and a method of assembling a heat sink to an electronic device. The invention particularly relates to a heat sink assembly that includes a clip which compresses a heat sink against an electronic device. A heat sink assembly includes an electronic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Sopko, Jeffrey J, Anderson, George R, Hsieh, George
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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