Heat sink assembly and method
The present invention relates to a heat sink assembly and a method of assembling a heat sink to an electronic device. The invention particularly relates to a heat sink assembly that includes a clip which compresses a heat sink against an electronic device. A heat sink assembly includes an electronic...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to a heat sink assembly and a method of assembling a heat sink to an electronic device. The invention particularly relates to a heat sink assembly that includes a clip which compresses a heat sink against an electronic device.
A heat sink assembly includes an electronic device, a heat sink and a clip that compresses the heat sink against the electronic device. A spacer is mounted on the clip to restrain motion of the heat sink relative to the electronic device. A method of securing a heat sink to an electronic device includes compressing the heat sink against the electronic device with a clip, and attaching a spacer to the clip in order to restrain motion. |
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