Method for forming micro lens structures

The present invention relates to the manufacture of semiconductor devices incorporating micro lens structures and, more particularly to the manufacture of micro lens structures where micro lens merger and collapse phenomena are minimized. The present invention features a method for forming micro lens arrays on light-sensitive or light-emitting semiconductor structures. A unique oxygen plasma etch "descum" step is performed prior to the lens reflow hardbake. In addition, a photo-sensitive planarization layer place immediately atop a color filter layer results in fewer process steps. The micro lens array thus formed has a minimal number of merged or collapsed lenses and residue on bond pad areas is significantly reduced.