Method of forming an alignment feature in or on a multilayered semiconductor structure

The present invention relates to integrated circuits and, more particularly, to a method of forming an alignment feature in or on a multi-layered semiconductor structure for aligning a lithography mask and that may be used in connection with a SCALPEL tool. A method of forming a multi-layered semico...

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Bibliographische Detailangaben

Hauptverfasser:	Boulin, David M, Farrow, Reginald C, Kizilyalli, Isik C, Layadi, Nace, Mkrtchyan, Masis
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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