Package having a multilayer film disposed around a layered coil of filament strands

The present invention relates to a package having a multilayer film disposed around a layered coil of filament strands. More particularly, the present invention relates to a package having a multilayer film comprising an ionomer, disposed around a layered coil of filament strands such that the ionomer contacts the layered coil of filament strands. A package comprises a layered coil of filament strands, and a multilayer film surrounding, and in direct contact with, the layered coil of filament strands. The coil has an outer surface comprising a bottom surface region, a side surface region, and a top surface region. The film has an inside surface comprising ionomer in direct contact with the side surface region of the layered coil of filaments. The strand material preferably comprises glass fiber and the sleeve preferably comprises a multilayer film having an outer layer comprising ionomer. Preferably, the film has a stiffness sufficient to maintain structural integrity of the package as the strands are being removed in order to prevent collapse of the side walls of the package and entanglement of the strands.