Power conditioning substrate stiffener
The field of the invention is integrated circuit packaging. Utilization of the "dead space" previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as de-coupling capacitors and planar transformers.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The field of the invention is integrated circuit packaging.
Utilization of the "dead space" previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as de-coupling capacitors and planar transformers. |
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