Quick slip die plate and method of mounting and removing the same

The present invention relates generally to viscous material dispensing systems or apparatus, such as, for example, systems or apparatus for dispensing and distributing adhesive or resin materials, and more particularly to a die plate which is adapted to be incorporated within the system or apparatus wherein the die plate is provided with structural means which permits the die plate to be rapidly and easily mounted upon and removed from, for example, the operatively associated glue block or adhesive manifold. A plate member, which may be a die plate or a shim, which is adapted to be used within a fluid material dispensing system, such as, for example, a system for dispensing or distributing adhesives upon substrates, is provided with a plurality of apertures equally spaced along the longitudinal extent thereof. The apertures comprise a plurality of through-bores for respectively receiving a plurality of fasteners, which are adapted to secure the plate member to a support structure, for example, an adhesive manifold or the like. In addition to the through-bores, milled slots are also provided within the plate member, the milled slots connecting the through-bores to a free edge portion of the plate member. In this manner, when the plate member is to be removed from the support structure so as to be replace with a new or different plate member, the fasteners need only be untightened, but not removed from the support structure, the plate member can be slidably removed from the support structure, a new plate member can be slidably mounted upon the support structure, and the fasteners are then re-tightened. The process of simply untightening the fasteners but not having to completely remove the same from the support structure, and then re-tightening the fasteners, saves considerable operating time and eliminates tedious work for operator personnel.