Integrated circuit heat sink support and retention mechanism

The invention relates generally to the mechanics of integrated circuit heat sinks, and more specifically to a heat sink mounting mechanism. The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wong, Thomas, Ulen, Neal, Davison, Peter, Shah, Ketan
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates generally to the mechanics of integrated circuit heat sinks, and more specifically to a heat sink mounting mechanism. The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.