Device for thermally, stably supporting a miniaturized component

The invention relates to a device for supporting a miniaturized, especially an electronic or optical, component, according to the preamble of claim 1. The invention related to a device for supporting a miniaturized, especially electronic or optical component, including a first and a second part, the second part is affixed to the first part on one side at a fixing point, in a cantilevered manner, and supports the component. The projection of the support area of the component onto the first part lies between the fixing point and a predetermined point of reference on the first part. The position of the support area of the component on the second part is chosen in relation to the fixing point between the first and second part and the respective material for the first and second parts is chosen with a specific temperature-dependent expansion coefficient and , in such a way that the influence of the temperature-dependent expansion of the first and second part on the position of the support area of the component is at least partially offset in relation to the point of reference.