Method for sawing a moulded leadframe package

Method for sawing a moulded leadframe package

This application claims priority under 35 U.S.C. §119 from Malaysian patent application serial number PI 20002854, filed Jun. 23, 2000. The present invention relates to a new method for sawing a moulded leadframe package () into individual integrated circuits (). In the present invention sawing of t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Huat, Lee Kock, Meng, Chan Boon, Keung, Phuah Kian, Sin, Lee Huan, Tuck, Cheong Mun
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This application claims priority under 35 U.S.C. §119 from Malaysian patent application serial number PI 20002854, filed Jun. 23, 2000. The present invention relates to a new method for sawing a moulded leadframe package () into individual integrated circuits (). In the present invention sawing of the moulded leadframe package () is done on the leads () instead of on the connecting bar () resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.