Enhanced design and process for a conductive adhesive

Enhanced design and process for a conductive adhesive

The present invention relates to a device and method for forming an improved conductive interconnection between a voltage plane on the back side of a printed circuit card or board and a thick metal heat sink in which flow of the adhesive is limited during lamination. The present invention provides a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Farquhar, Donald Seton, Kohut, Gerard Paul, Seman, Andrew Michael, Klodowski, Michael Joseph
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Farquhar, Donald Seton
Kohut, Gerard Paul
Seman, Andrew Michael
Klodowski, Michael Joseph
description The present invention relates to a device and method for forming an improved conductive interconnection between a voltage plane on the back side of a printed circuit card or board and a thick metal heat sink in which flow of the adhesive is limited during lamination. The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06534724</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06534724</sourcerecordid><originalsourceid>FETCH-uspatents_grants_065347243</originalsourceid><addsrcrecordid>eNrjZDB1zctIzEtOTVFISS3OTM9TSMxLUSgoyk9OLS5WSMsvUkhUSM7PSylNLsksS1VITMkAqipL5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXx6UWJIMrAzNTYxNzIxJgIJQAVsS3P</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Enhanced design and process for a conductive adhesive</title><source>USPTO Issued Patents</source><creator>Farquhar, Donald Seton ; Kohut, Gerard Paul ; Seman, Andrew Michael ; Klodowski, Michael Joseph</creator><creatorcontrib>Farquhar, Donald Seton ; Kohut, Gerard Paul ; Seman, Andrew Michael ; Klodowski, Michael Joseph ; International Business Machines Corporation</creatorcontrib><description>The present invention relates to a device and method for forming an improved conductive interconnection between a voltage plane on the back side of a printed circuit card or board and a thick metal heat sink in which flow of the adhesive is limited during lamination. The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.</description><language>eng</language><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6534724$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,309,781,803,886,64041</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6534724$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Farquhar, Donald Seton</creatorcontrib><creatorcontrib>Kohut, Gerard Paul</creatorcontrib><creatorcontrib>Seman, Andrew Michael</creatorcontrib><creatorcontrib>Klodowski, Michael Joseph</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Enhanced design and process for a conductive adhesive</title><description>The present invention relates to a device and method for forming an improved conductive interconnection between a voltage plane on the back side of a printed circuit card or board and a thick metal heat sink in which flow of the adhesive is limited during lamination. The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZDB1zctIzEtOTVFISS3OTM9TSMxLUSgoyk9OLS5WSMsvUkhUSM7PSylNLsksS1VITMkAqipL5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXx6UWJIMrAzNTYxNzIxJgIJQAVsS3P</recordid><startdate>20030318</startdate><enddate>20030318</enddate><creator>Farquhar, Donald Seton</creator><creator>Kohut, Gerard Paul</creator><creator>Seman, Andrew Michael</creator><creator>Klodowski, Michael Joseph</creator><scope>EFH</scope></search><sort><creationdate>20030318</creationdate><title>Enhanced design and process for a conductive adhesive</title><author>Farquhar, Donald Seton ; Kohut, Gerard Paul ; Seman, Andrew Michael ; Klodowski, Michael Joseph</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_065347243</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Farquhar, Donald Seton</creatorcontrib><creatorcontrib>Kohut, Gerard Paul</creatorcontrib><creatorcontrib>Seman, Andrew Michael</creatorcontrib><creatorcontrib>Klodowski, Michael Joseph</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Farquhar, Donald Seton</au><au>Kohut, Gerard Paul</au><au>Seman, Andrew Michael</au><au>Klodowski, Michael Joseph</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Enhanced design and process for a conductive adhesive</title><date>2003-03-18</date><risdate>2003</risdate><abstract>The present invention relates to a device and method for forming an improved conductive interconnection between a voltage plane on the back side of a printed circuit card or board and a thick metal heat sink in which flow of the adhesive is limited during lamination. The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_06534724
source USPTO Issued Patents
title Enhanced design and process for a conductive adhesive
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T13%3A03%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Farquhar,%20Donald%20Seton&rft.aucorp=International%20Business%20Machines%20Corporation&rft.date=2003-03-18&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06534724%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true