Enhanced design and process for a conductive adhesive
The present invention relates to a device and method for forming an improved conductive interconnection between a voltage plane on the back side of a printed circuit card or board and a thick metal heat sink in which flow of the adhesive is limited during lamination. The present invention provides a...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to a device and method for forming an improved conductive interconnection between a voltage plane on the back side of a printed circuit card or board and a thick metal heat sink in which flow of the adhesive is limited during lamination.
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free. |
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