Method of making a parallel capacitor laminate

The present invention relates generally to printed circuit boards, and more particularly to a laminate structure capable of being used in such circuit boards as an internal capacitor member. The invention also relates to possible utilization of such a resulting circuit board structure as an interposer for coupling circuitized structures, including, for example, other circuit boards, modules, etc. A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.