Circuit board having a through hole having an insulating material inside and a conductive element

The present invention relates to a structure and method for replacing electrical nets (point to point connections within a circuit board). More particularly, the present invention relates to a structure and method capable of replacing electrical nets in two sided component surface mount carriers as well as single sided board assemblies. The present invention can be employed on traditional "dogbone" BGA sites as well as the newer denser BGA patterns where traces extend in different patterns from the pad to the via. Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electrically connects to a BGA pad or surface trace line.