Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher

The present invention is directed, in general, to integrated circuits and, more specifically, to a chemical mechanical planarization system including a pad conditioner and a method of making integrated circuits using the chemical mechanical planarization system. A method of manufacturing a semiconductor device employing a polishing pad conditioner that directs a fluid stream at a polishing pad to remove accumulated material from the pad. The fluid stream may contact a large area of the polishing pad or a smaller area where the fluid stream is moved to condition different areas of the polishing pad. The fluid stream may include abrasive particles to promote the removal of the accumulated materials. The velocity of the fluid stream may be increased or decreased to promote removal of the accumulated materials. In yet another embodiment, the present invention is directed to a process for manufacturing an integrated circuit using a CMP process where the pad has been conditioned using the fluid stream. The present invention is also directed to a chemical mechanical planarization system including a pad conditioner.