Printed circuit board arrangement
1. Field of the Invention Methods and apparatus for forming a metal shield on a printed circuit board () include a layer of dielectric material () one or more printed circuits () on the layer of dielectric material (), a layer of metal () on the layer of dielectric material (), a metal-clad trench o...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | 1. Field of the Invention
Methods and apparatus for forming a metal shield on a printed circuit board () include a layer of dielectric material () one or more printed circuits () on the layer of dielectric material (), a layer of metal () on the layer of dielectric material (), a metal-clad trench or opening surrounding the printed circuit () and electrically connected to the layer of metal(27), a solder pad () on the layer of dielectric material (), a microvia () through the solder pad () and the layer of dielectric material (), and electrical components () soldered to the solder pads () and to the printed circuit (). |
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