Component and method for manufacture
The present invention relates, in general, to electronic components and, more particularly, to protection of electronic devices using cap wafers. A component () includes a substrate (), a cap wafer (), and a protection layer () formed over a surface of the cap wafer (). Together, the protection laye...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present invention relates, in general, to electronic components and, more particularly, to protection of electronic devices using cap wafers.
A component () includes a substrate (), a cap wafer (), and a protection layer () formed over a surface of the cap wafer (). Together, the protection layer () and the cap wafer () form a cap structure () that is bonded to the substrate () via a bonding layer (). An opening () is formed in the cap wafer () by etching the cap wafer (). The protection layer () provides protection during etching of the cap wafer () for the underlying bonding layer () and devices () formed in the substrate (). |
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