Sleeve shrinking quick dip system

The present invention generally relates to systems and methods for quickly shrinking encasing materials. A system and method for quickly heating a shrinkable casing around a relatively non-shrinkable object. The system may be referred to as a sleeve shrinking quick dip heat system. As one example, the present invention may be used to shrink a sleeve around a strand, such as fiber or copper. In the electrical and electronic fields, the present invention may be used to shrink sleeves or tubing around, for example, copper strands, wires, connectors, or components. A contact approach to heating the a loaded sleeve is used wherein a predetermined temperature profile is applied to prevent the trapping of air during shrinking. Ramp-up time is eliminated by use of a heater block that remains near or at heat shrinking temperatures, while selectively transferring heat to the sleeve according to the desired temperature profile.