Temperature-controlled chuck and method for controlling the temperature of a substantially flat object

The present invention generally relates to controlling the temperature of partial areas of a substantially flat object. More particularly, the present invention relates to a temperature-controlled chuck to hold a substantially flat object. With such a temperature-controlled chuck the temperature distribution of the substantially flat object can be sensed or measured, and due to temperature influencing elements the temperature of partial areas of said object's back side can be altered to obtain a more uniform temperature distribution. Furthermore, the present invention relates also to a temperature-controlled wafer chuck and a method for controlling the temperature of a substantially flat object such as a wafer. Finally, the invention relates also to a pre-align station of an exposure tool for wafers comprising a temperature-controlled wafer chuck, and relates to an exposure wafer chuck in an exposure tool for wafers comprising a wafer chuck with which the temperature of a wafer can be measured and influenced as desired. The present invention generally relates to a method for controlling the temperature of a substantially flat object and to a temperature-controlled chuck comprising a chuck body () having an object support side () and a back side (). Said object support side () holds a substantially flat object () having a front side () and a back side () on said back side () of said object (). A plurality of temperature sensing elements () is distributed on said object support side () to measure the temperature distribution of said flat object (). A plurality of individual temperature influencing elements () is distributed on said object support side () to face said back side () of said flat object (), each of said temperature influencing elements () being arranged to influence the temperature of a partial area of said object's back side () as desired.