Method for masking a hole in a substrate during plating
The present invention relates to fabricating a circuitized substrate having through-holes. More particularly, the present invention relates to a method for masking through-holes in a substrate during the circuitization or plating of the substrate. Through-holes in a substrate are masked during plati...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to fabricating a circuitized substrate having through-holes. More particularly, the present invention relates to a method for masking through-holes in a substrate during the circuitization or plating of the substrate.
Through-holes in a substrate are masked during plating of the substrate by substantially filling the through-holes with a liquid material, followed by applying a photoimageable material to an external surface of the substrate, forming a predetermined pattern in the photoimageable material, circuitizing the predetermined pattern and then removing both the photoimageable material and the liquid material from the through-holes. |
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