Apparatus for holding and delayering a semiconductor die

The present invention relates to methods and tools used in failure analysis of integrated circuit (IC) products in the semiconductor industry, and more particularly to a method of mechanically delayering a semiconductor die (also called an integrated circuit chip) in a controlled manner, and an apparatus for carrying out the method. A method and apparatus for holding and delayering a die include an outer member () that receives an inner member (), and a set screw () and set screw hole () for securing the position of the inner member () within the outer member (). A die () is attached to the inner member (), and the apparatus is then used to apply the die () to an abrasive disk () which is attached to a rotatable wheel () and is delayered by progressive abrading. The outer member () provides stability and precision to the delayering operation. The inner member () provides portability and control to the delayering operation.