Circuit board having burr free castellated plated through holes
1. Technical Field The present invention provides a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation during conventional profiling, is removed or pre-profiled to off-set the leading edge...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | 1. Technical Field
The present invention provides a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation during conventional profiling, is removed or pre-profiled to off-set the leading edge of the plated through hole from a surface of the circuit board. |
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