Bond pad structure and method for reduced downward force wirebonding
The invention relates to wirebonding and, more particularly, to an apparatus and method for reduced downward force wirebonding of integrated circuits. A bond pad structure for an integrated circuit has bondable base member for receiving a wire bonded thereon. A cavity is formed within the base membe...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to wirebonding and, more particularly, to an apparatus and method for reduced downward force wirebonding of integrated circuits.
A bond pad structure for an integrated circuit has bondable base member for receiving a wire bonded thereon. A cavity is formed within the base member, with the cavity being configured to capture the wire therein. The cavity has one end having a first width and an opposite end having a second width, with the first width being greater than second width. |
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