Plastic molding compound, composite body, and filler for a plastic molding compound

Plastic molding compound, composite body, and filler for a plastic molding compound

The invention relates to plastic composite bodies such as electrical components which have a body of a semiconductor material, for example a microchip. An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at...

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Hauptverfasser: Neu, Achim, Atzesdorfer, Alexandra, Janczek, Thies
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Sprache:eng
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creator Neu, Achim
Atzesdorfer, Alexandra
Janczek, Thies
description The invention relates to plastic composite bodies such as electrical components which have a body of a semiconductor material, for example a microchip. An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers.
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title Plastic molding compound, composite body, and filler for a plastic molding compound
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