Plastic molding compound, composite body, and filler for a plastic molding compound
The invention relates to plastic composite bodies such as electrical components which have a body of a semiconductor material, for example a microchip. An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to plastic composite bodies such as electrical components which have a body of a semiconductor material, for example a microchip.
An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers. |
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