Method of fabricating thin integrated circuit units

The present invention relates in general to the field of integrated circuit packaging and, more specifically, can relate to integrated circuit packages and a method for producing the same wherein the integrated circuit packages are electrically connected to one another to form a memory unit for use in attachment to a printed circuit board to form a module. A high density unit () comprising a first integrated circuit package () comprising a carrier () having first and second sides (), a silicon chip () attached by an adhesive layer () and solder bonding () electrically connecting the silicon chip () to the carrier () stackably and electrically connected to a second integrated circuit package (), is disclosed.