Deformation-absorbing leadframe for semiconductor devices

The present invention is related in general to the field of semiconductor devices and processes and more specifically to the structure, materials and fabrication of leadframes for integrated devices. A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; and each said support member having at least one portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member.