Process for preparing and replenishing an electrolyte in an electrolyte bath

The present invention is directed to a process and apparatus for preparing an electrolyte bath and for replenishing an electrolyte in an electrochemical bath. More particularly, the invention is directed to a process for feeding a metal salt into an electrolyte solution that has been depleted of an electrolyte during an electrochemical process to replenish the solution with the electrolyte. A process and apparatus for supplying a soluble metal compound to an electrolyte solution uses a powder wetting device in a loop from a working tank. The powder wetting machine supplies the powdered metal compound directly into the electrolyte solution which rapidly dissolves to replenish the electrolyte compound during the treating process. The process and apparatus are particularly suitable for replenishing the metal salts consumed during an electroplating process.